They may replace plastic and ease the environmental pressure.

The Root Issue Substrates, which serve as the foundational components for regulating the temperature of computer systems, constitute a substantial portion of many electronic devices. Regrettably, they are notoriously challenging to separate from other components and are primarily composed of non-recyclable plastics.

In essence, substrates significantly contribute to the estimated 50 million metric tons of electronic waste generated annually, a significant environmental challenge, while its management becoming is becoming increasingly complex.

The above-mentioned substrate poses the greatest recycling challenge, accounting to the largest portion of electronic devices.

To address this issue, a team of Austrian scientists is pioneering an innovative solution to address a portion of the e-waste dilemma: the creation of biodegradable substrates for electronics using mushroom skins.

The unconventional method, which is described in a proof-of-concept paper published in Science Advances by the scientists at Kepler University in Linz, Austria, demonstrates the immense potential of the new materials, named "MycelioTronics," as a viable alternative to traditional plastic printed circuit boards, among other applications. 

Revolutionary solution

The developers said in a press release that the breakthrough discovery involving mushrooms began as a fortuitous accident in a laboratory.

While investigating the possibility of using mushroom skin for home insulation, the researchers stumbled upon the remarkable resilience, flexibility, and heat resistance of the mycelium-covered skins of reishi mushrooms. 

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These skins proved capable of withstanding temperatures of nearly 500 degrees Fahrenheit, making them ideal for use in electronic substrates. Notably, the researchers have highlighted that these products have the potential to enjoy a prolonged lifespan if shielded from UV light.

When it eventually becomes necessary to retire a device, the substrate can be simply placed in soil, where it will naturally biodegrade, thus separating from the more recyclable computer components it holds.

The material underwent testing by soldering a standard computer chip onto it, with the mushroom skin performing admirably. While it is not yet ready for large-scale production, the aspiration is that this mycelium-based material will one day become the standard for printed circuit boards, flexible electronics, and even certain medical devices.